SINOLINK SECURITIES(SH:600109) Zhi Tong Cai Jing·2025-09-08 02:33Group 1 - The core viewpoint is that the AI-ASIC market is experiencing high growth, with continuous increases in CAPEX, and ASICs are becoming a key incremental component in the AI-PCB segment, with total shipments expected to surpass NVIDIA's GPUs by 2026 [1][2][3] - Broadcom reported its Q3 FY2025 results with AI semiconductor revenue reaching $5.2 billion, a 63% year-over-year increase, and projected Q4 revenue of $6.2 billion, a 19% quarter-over-quarter increase [1] - Meta plans to invest at least $600 billion in data centers and infrastructure in the U.S. by 2028, with AI capital expenditures expected to reach $66-72 billion in 2025, reflecting a minimum growth of 68% year-over-year [2] Group 2 - By 2025, Google is expected to ship 1.5-2 million TPU units, while Amazon's AWS T2 is projected to reach 1.4-1.5 million units, and NVIDIA's AIGPU supply is expected to exceed 5-6 million units [2] - The total shipment of ASICs is anticipated to exceed NVIDIA's GPU shipments in 2026, driven by Meta's large-scale deployment of its self-developed ASIC solutions starting in 2026 and Microsoft's deployment in 2027 [2][3] - Leading companies in the AI electronic fabric and copper foil sectors have reported profits from AI, with significant expansions and price increases validating the industry's prosperity [3] Group 3 - The year 2025 is expected to mark the beginning of widespread adoption of liquid cooling, initially penetrating AI servers, with ASICs contributing significant growth in 2026-2027 [4] - Companies are focusing on liquid cooling technologies, including liquid cooling plates and new materials such as cooling liquids and aluminum/copper materials [4] - There are also upgrade opportunities in AIPCB equipment, such as exposure machines and laser drilling [4]