有研粉材(688456.SH)：公司未来产业针对微纳级铜粉、银粉、银包铜粉、镍粉及其浆料等产品开展技术开发

Core Viewpoint - The company is focusing on the development of micro-nano level copper powder, silver powder, silver-coated copper powder, nickel powder, and their slurries to expand the variety of interconnection materials applicable in products like PCBs and MLCCs [1] Group 1 - The company is engaged in technological development for micro-nano level materials [1] - The product range includes copper powder, silver powder, silver-coated copper powder, and nickel powder [1] - These materials are intended for use in PCB and MLCC applications [1]