凌云光：代理引入的光电子集成芯片设计封装解决方案适用于CPO/OIO小尺寸多通道封装

Core Viewpoint - The company is introducing a photonic integrated chip design and packaging solution that utilizes 3D lithography technology, which enhances precision and reduces signal attenuation, making it suitable for industrial mass production [1] Group 1 - The solution employs polymer waveguides of arbitrary shapes, replacing traditional lens coupling with photonic wire bonding [1] - The technology is particularly applicable for CPO/OIO small-sized multi-channel packaging [1] - The advantages include high alignment accuracy and reduced optical signal loss, which are critical for industrial applications [1]