芯碁微装：发行境外上市股份(H 股)备案申请材料获中国证监会接收

Core Viewpoint - Chipbond Microelectronics (688630.SH) has submitted an application for issuing H-shares and listing on the Hong Kong Stock Exchange, indicating a strategic move to expand its capital base and market presence [1] Group 1 - The company submitted its application to the Hong Kong Stock Exchange on August 31, 2025 [1] - The application materials for the issuance and listing were published on the Hong Kong Stock Exchange's website on the same day [1] - The company has also submitted the filing materials for this issuance and listing to the China Securities Regulatory Commission, which has recently accepted the application [1]