Core Viewpoint - Suzhou Bank has successfully issued the "Suzhou Bank Co., Ltd. 2025 First Phase Technology Innovation Bond" with a total issuance size of RMB 2 billion, aimed at supporting technology innovation sectors [1] Group 1: Bond Issuance Details - The bond was completed on September 10, 2025, and payment was finalized on September 12, 2025 [1] - The bond has a fixed interest rate of 1.89% and a maturity period of 5 years [1] Group 2: Fund Utilization - The raised funds will be used in accordance with applicable laws and regulatory approvals, specifically for technology-related projects as outlined in the "Five Major Articles of Finance" [1] - The funds will support activities such as issuing loans for technology and investing in bonds issued by technology innovation enterprises [1]
苏州银行发行20亿元科技创新债券