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华为算力全面出击:昇腾950明年上市 徐直军称超节点超英伟达

Core Insights - Huawei is positioning itself as a leader in AI computing power, directly competing with Nvidia by unveiling a comprehensive AI computing architecture at the Huawei Connect Conference [1][2] - The company has ambitious plans for its Ascend chip series, with multiple new chips scheduled for release between 2026 and 2028, indicating a long-term commitment to enhancing AI capabilities [1][3] - Huawei's new supernodes and superclusters, including Atlas 950 and Atlas 960, are touted as the world's strongest computing clusters, with capabilities exceeding 500,000 and 1 million cards respectively [2] Group 1: AI Computing Power - Huawei's Ascend chip roadmap includes the release of Ascend 950PR in Q1 2026, Ascend 950DT in Q4 2026, Ascend 960 in Q4 2027, and Ascend 970 in Q4 2028, showcasing a strategic long-term vision for AI chip development [1][3] - The company emphasizes the importance of computing power as a key driver for artificial intelligence, particularly in the context of China's AI development [1] Group 2: Supernodes and Superclusters - The Atlas 950 SuperPoD and Atlas 960 SuperPoD supernodes support 8,192 and 15,488 Ascend cards respectively, setting new benchmarks in computing power, memory capacity, and interconnect bandwidth [1][2] - Huawei has deployed over 300 CloudMatrix 384 supernodes, serving more than 20 clients, indicating a strong market presence and customer adoption [2] Group 3: Interconnect Technology - Huawei has developed a new interconnect protocol called Lingqu, aimed at addressing the challenges of large-scale supernode interconnectivity, and plans to open the Lingqu 2.0 technology specifications to foster an open ecosystem [4]