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长电科技(600584.SH):已布局多项机器人相关封装项目并与机器人控制系统客户联合开发系统级封装方案
JCETJCET(SH:600584) Ge Long Hui·2025-09-22 08:02

Core Viewpoint - Changdian Technology (600584.SH) has launched a one-stop system-level packaging solution targeting high-performance computing scenarios, covering packaging needs for computing, storage, power, and network-related chips [1] Group 1: Product Development - The new packaging solution supports multi-chip heterogeneous integration and has established multi-level packaging and testing capabilities to meet various application fields [1] - In the fields of industrial automation and smart terminals, Changdian Technology has initiated multiple robot-related packaging projects and is collaborating with robot control system customers to develop system-level packaging solutions [1] Group 2: Market Positioning - The company's efforts aim to enhance system integration and reliability, positioning itself as a key player in the evolving landscape of high-performance computing and robotics [1]