Core Viewpoint - Changdian Technology (600584.SH) has launched a one-stop system-level packaging solution targeting high-performance computing scenarios, covering packaging needs for computing, storage, power, and network-related chips [1] Group 1: Product Development - The new solution supports multi-chip heterogeneous and heterogeneous integration, indicating advanced capabilities in packaging technology [1] - Changdian Technology has established multi-level packaging and testing capabilities to meet various application fields [1] Group 2: Industry Applications - The company has laid out multiple robot-related packaging projects in the fields of industrial automation and smart terminals [1] - Collaborations with customers in robot control systems have been initiated to develop system-level packaging solutions, enhancing system integration and reliability [1]
长电科技:已布局多项机器人相关封装项目并与机器人控制系统客户联合开发系统级封装方案