晶合集成向港交所递交上市申请 近三年研发支出32亿元

Core Viewpoint - Hefei Jinghe Integrated Circuit Co., Ltd. has submitted a listing application to the Hong Kong Stock Exchange, with CICC as the exclusive sponsor, while currently being listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board [1] Group 1: Company Overview - The company is a global leader in 12-inch pure wafer foundry services, focusing on advanced process research and application, providing wafer foundry services across process nodes from 150nm to 40nm, and steadily advancing the 28nm platform [4][5] - The company has established mass production capabilities for technology nodes from 150nm to 40nm and has a diverse process platform covering DDIC, CIS, PMIC, Logic IC, and MCU, which supports its leading position in key market segments [5][6] Group 2: Market Position and Growth - According to Frost & Sullivan, from 2020 to 2024, the company has the fastest capacity and revenue growth among the top ten global wafer foundry companies, and by 2024, it is projected to be the ninth largest globally and the third largest in mainland China by revenue [4] - The company is expected to be the largest DDIC wafer foundry globally and the fifth largest CIS wafer foundry globally by 2024, as well as the third largest CIS wafer foundry in mainland China [5] Group 3: Financial Performance - The company's revenue for the years ending December 31 for 2022, 2023, and 2024, as well as for the six months ending June 30, 2024, and 2025, were RMB 10.026 billion, RMB 7.183 billion, RMB 9.120 billion, RMB 4.331 billion, and RMB 5.130 billion respectively [6] - The company's attributable profit for the same periods were RMB 3.045 billion, RMB 119 million, RMB 482 million, RMB 195 million, and RMB 232 million respectively [6][7] Group 4: R&D and Future Plans - The company has a high-quality R&D team with 1,924 members, accounting for 35% of total employees, with 64.8% holding a master's degree or higher, reflecting its academic depth and professional strength [6] - The funds from the upcoming financing will be used for R&D and optimization of a new generation 22nm technology platform, AI-based intelligent R&D and production planning, establishing a R&D and sales center in Hong Kong, and general corporate purposes [9]