JCET(SH:600584) 3 6 Ke·2025-10-11 10:31Core Viewpoint - Zhuhai is a significant hub for China's semiconductor industry, ranking among the top ten cities in the country for integrated circuit design sales. The city hosts a comprehensive enterprise matrix covering the entire semiconductor industry chain, including notable companies like Yueya Semiconductor, which recently submitted an IPO application to the Shenzhen Stock Exchange for listing on the ChiNext board, with CITIC Securities as the sponsor [1][2]. Company Overview - Yueya Semiconductor was established in April 2006 and completed its share reform in July 2012, headquartered in Doumen District, Zhuhai. The largest shareholder is AMITEC, holding 39.95%, followed by New Xinchuan with 37.23%. The company has no controlling shareholder or actual controller [2][3]. - The major products of Yueya Semiconductor include advanced packaging key materials and products, specifically IC packaging substrates and embedded packaging modules. These products are crucial for connecting wafers and PCBs, directly impacting the performance of related chips and end products [3][4]. Financial Performance - Yueya Semiconductor's revenue for the years 2022, 2023, 2024, and the first half of 2025 was 1.667 billion, 1.705 billion, 1.796 billion, and 811 million yuan respectively. The net profit attributable to the parent company was 415 million, 188 million, 215 million, and 91.47 million yuan, indicating a significant decline in net profit in 2023 [5][6]. - The company's gross profit margin has been declining, with margins of 38.97%, 26.65%, 25.49%, and 24.42% over the same periods. The decline in gross profit margin is attributed to decreased margins in various product lines, particularly the FC-BGA packaging substrates [9][10]. Product Segmentation - The revenue contribution from IC packaging substrates was 85.41%, 90.42%, 88.37%, and 67.54% over the reporting periods, making it the primary revenue source. The embedded packaging module's revenue share increased from 14.59% in 2022 to 32.46% in the first half of 2025, driven by increased demand from major clients like Infineon [7][8]. Market Dynamics - The global packaging substrate market is recovering from a cyclical low of $16 billion in 2023, with expectations to reach $21.4 billion by 2026, fueled by demand from emerging markets such as 5G, AI, IoT, and automotive electronics [20]. - Despite the growth potential, the Chinese mainland's contribution to the global packaging substrate market remains low, with local enterprises accounting for only about 5% of the actual contribution, while Taiwan, Korea, and Japan dominate the market [21][23]. Future Prospects - Yueya Semiconductor plans to raise 1.28 billion yuan through its IPO, primarily for expanding production capacity for high-performance embedded packaging modules aimed at the AI sector, as well as for a research and development center and working capital [24].