中天精装(002989.SZ)：参股企业产品用于CPU、GPU、AI及车载等高算力芯片的封装

Core Viewpoint - Zhongtian Jingzhuang (002989.SZ) announced that its investee, Core Semiconductor Technology (Dongyang) Co., Ltd., has successfully launched the first phase of its FCBGA high-end packaging substrate project on September 27, 2025, which is intended for packaging high-performance chips used in CPUs, GPUs, AI, and automotive applications [1] Group 1 - The FCBGA project is aimed at high-performance chip packaging, indicating a strategic focus on advanced technology sectors [1] - The company will continue to monitor the operational developments of its investee and will fulfill its information disclosure obligations if there are significant investment progress or impactful events [1]