深科技：存储半导体封测产能可满足订单需求

Core Viewpoint - The company is actively managing its semiconductor packaging and testing capacity to meet current order demands and is prepared to expand if customer demand increases in the future [1] Group 1 - The company's semiconductor packaging and testing business capacity is progressing in an orderly manner [1] - Current capacity utilization is sufficient to meet order demands [1] - The company will continue to monitor market opportunities and will prioritize meeting the needs of major customers when considering expansion plans [1]