兴森科技(002436.SZ)：不涉及封装业务

Core Viewpoint - The company, Xingsen Technology (002436.SZ), clarified on an interactive platform that it does not engage in packaging business, but its FCBGA packaging substrate can be used for HBM3E packaging [1] Group 1 - The company does not involve itself in the packaging business [1] - FCBGA packaging substrate is applicable for HBM3E packaging [1]