国金证券：响应AI芯片散热革命 3D打印液冷板前景广阔

Core Insights - The liquid cooling market in China's intelligent computing centers is projected to reach 18.4 billion yuan in 2024, representing a 66% year-on-year growth, and is expected to further expand to 130 billion yuan by 2029, indicating a potential market explosion [1] - Cold plate liquid cooling is anticipated to become the mainstream cooling solution for data centers due to its higher efficiency compared to traditional air cooling methods, especially as GPU power design continues to increase [1][2] - 3D printing is expected to emerge as the optimal manufacturing technology for liquid cooling plates, offering advantages over traditional machining methods [2][4] Market Trends - The cold plate liquid cooling method is the most widely used, utilizing a closed cavity made of copper or aluminum to conduct heat without direct contact with the liquid, thus requiring less redesign of existing data center equipment [1] - The historical data indicates that cooling can account for up to 40% of a data center's energy consumption, highlighting the importance of efficient cooling solutions [1] Technological Advancements - 3D printing allows for complex flow channel designs that enhance cooling performance, overcoming limitations faced by traditional manufacturing methods [2][3] - Microchannel liquid cooling plates are becoming a new trend, with companies like Jinfu Technology successfully developing microchannel designs that improve heat dissipation [3] - The industry is transitioning from traditional machining methods to 3D printing for liquid cooling plate production, driven by the need for intricate designs and improved performance [3][4] Industry Developments - Companies are developing advanced 3D printing technologies to overcome the challenges of printing with copper, which has high reflectivity in the red light spectrum [4] - Several firms have successfully launched 3D printed liquid cooling plate products, demonstrating the feasibility and advantages of this technology in the market [4]