乐歌股份成功发行第一期科技创新债券

Core Points - Lege Co., Ltd. successfully issued its first phase of technology innovation bonds, marking a significant milestone in the domestic smart home and public overseas warehouse sector [1][2] - The bond has a registered amount of 800 million yuan, with an issuance scale of 250 million yuan, a term of 546 days, an AAA rating, and a coupon rate of 2.59% [1] - This issuance is the first technology innovation bond in the entire market for the furniture manufacturing industry and the first for a private enterprise listed on the Growth Enterprise Market in Zhejiang Province [1] Financing and Future Strategy - The successful issuance of the technology innovation bond is a continuation of Lege's efficient financing practices, following various capital market activities since 2020 [2] - The company aims to continuously expand its financing channels and enhance its competitiveness and influence in the capital market to lay a solid foundation for long-term development [2] - The funds raised will be used entirely to repay the company's maturing debts, reducing overall funding costs and supporting high-quality development [1]