帝尔激光(300776.SZ)：目前，超快激光钻孔设备样机正在试制中。

Core Viewpoint - The company has successfully completed the shipment of through-hole equipment for panel-level glass substrates, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology [1] Group 1: Company Developments - The company's TGV laser micro-hole equipment has been shipped, marking a significant milestone in its technology offerings [1] - The company is focusing on the development of ultrafast laser drilling technology for its PCB business and has engaged with 2 to 3 clients for collaboration [1] - A prototype of the ultrafast laser drilling equipment is currently under trial production [1]