帝尔激光：目前，超快激光钻孔设备样机正在试制中。

Core Insights - The company has completed the shipment of panel-level glass substrate through-hole equipment, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology [1] - The company's PCB business is primarily focused on the development of ultrafast laser drilling technology, with ongoing engagement with 2 to 3 clients [1] - A prototype of the ultrafast laser drilling equipment is currently under trial production [1]