兴森科技：公司CSP封装基板主要下游包括存储芯片等领域

Core Viewpoint - The company, Xingsen Technology, has indicated that its CSP packaging substrates primarily serve downstream sectors including storage chips and RF chips, with a customer base that includes major South Korean and domestic storage chip clients [1] Group 1 - The main downstream applications of the company's CSP packaging substrates are in storage chips and RF chips [1] - The customer base for the company's products includes significant South Korean and domestic storage chip clients [1]