埃隆·马斯克正在美国建立一条完整的芯片生产链

Core Insights - Elon Musk is establishing a complete chip production and packaging chain in the U.S., including a wafer fab to meet the needs of Tesla, SpaceX, and Starlink [1][3] Group 1: Chip Production and Packaging - Musk is creating his own version of TSMC to ensure independence in critical situations, driven by capacity lock-in and supply issues [3] - A new PCB center in Texas is operational, and a FOPLP factory is set to begin small-scale production by Q3 2026 [3] - SpaceX aims to integrate satellite chip packaging technology to reduce costs and maintain control over Starlink components, with a significant reduction in procurement from external suppliers expected by 2027 [3] Group 2: Wafer Fabrication Facility - Musk plans to build a massive wafer factory capable of producing 100,000 wafers per month, with a long-term goal of reaching 1 million wafers [4] - While it may not compete with TSMC on advanced process nodes, it can produce circuits at 14nm and smaller, aligning with Musk's vision for robotics, autonomous driving, and satellite networks [4] - Tesla and SpaceX may leverage this technology to mitigate geopolitical risks and capacity constraints [4]