加码AI？苹果首次招聘HBM工程师

Core Insights - Apple has initiated a recruitment process for DRAM packaging engineers, marking a significant shift in its approach to AI and data center technology [1][4] - The role will focus on developing next-generation storage packaging for Apple's future products and managing collaborations with semiconductor suppliers [1][4] - This recruitment is seen as a strategic move to reduce reliance on Google for AI training and to enhance Apple's capabilities in AI server technology [4] Group 1: Recruitment Details - The position requires candidates with a master's or doctoral degree and over 10 years of industry experience, particularly in HBM and high-performance storage [1] - Candidates should possess deep expertise in HBM architecture, including TSV design, die stacking, storage configuration, virtual channels, and thermal management [1] - Strong communication skills are essential for collaboration with internal teams and managing external suppliers [1] Group 2: Strategic Implications - This is the first time Apple has specifically recruited for DRAM packaging engineers, indicating a focus on AI servers and data centers [4] - Apple aims to invest heavily in AI infrastructure, moving away from reliance on Google Cloud TPU for AI training [4] - The company has begun producing advanced servers in the U.S. to support its private cloud computing and Apple Intelligence projects [4] Group 3: Technology and Partnerships - The job description highlights the need to address integration issues in advanced packaging technologies such as CoWoS, EMIB, SoIC, and PoP [5] - Due to tight capacity for TSMC's CoWoS technology, Apple may consider outsourcing some high-end AI chip packaging orders to Intel to avoid capacity bottlenecks [5] - The expectation is that Apple may develop high-performance AI chips specifically for data centers, potentially incorporating HBM technology [4]