兴森科技(002436.SZ)：公司CSP封装基板的主要应用领域之一是存储芯片

Core Viewpoint - The company, Xingsen Technology, has confirmed that one of the main application areas for its CSP packaging substrates is storage chips, indicating that its technology and production capacity can meet downstream customer demands [1]. Group 1 - The company specializes in CSP packaging substrates [1] - The primary application area for the company's products is in storage chips [1] - The company's technology and production capacity are aligned with the needs of downstream customers [1]