兴森科技(002436.SZ)：公司CSP封装基板订单饱满，整体景气度有望维持

Core Viewpoint - The company indicates that the application fields of its chip products are determined by customer needs, with specific customer information being confidential due to non-disclosure agreements [1] Group 1: Company Performance - The company reports a full order book for CSP packaging substrates due to the recovery in the downstream storage chip sector, suggesting that overall market conditions are expected to remain favorable [1] - The FCBGA packaging substrate project is currently in the small-batch production stage, with market expansion and customer certification progressing as planned [1] Group 2: Market Dynamics - The timeline for mass production of the FCBGA project primarily depends on the recovery of industry demand, the production progress of customers, and their supplier management strategies [1]