兴森科技(002436.SZ)：公司CSP封装基板的客户群体包括韩系和国内存储芯片大客户

Core Viewpoint - The company, Xingsen Technology, has indicated that its CSP packaging substrate customer base includes major Korean and domestic memory chip clients, with product pricing and gross margins being dependent on specific product structure, size, and processes, making it difficult to generalize [1] Group 1 - The customer base for Xingsen Technology's CSP packaging substrates includes both Korean and domestic major memory chip clients [1] - Product pricing and gross margins are influenced by specific factors such as product structure, size, and manufacturing processes [1] - The company emphasizes that it is not feasible to generalize pricing and gross margin information across all products [1]