中天精装：参股企业HBM产品进展及业务布局情况

Group 1 - The core focus of Zhongtian Jingzhuang's invested company, Shenzhen Yuanjian Zhichun Technology Co., Ltd., is on high bandwidth memory (HBM) chips, with HBM2/2e products completing final testing and moving towards mass production and upgrades [1][2] - HBM3/3e products are currently in the research and development phase, having completed preliminary research and some design work [1][2] - Another invested company, Kuiruisi Semiconductor Technology (Dongyang) Co., Ltd., specializes in ABF substrate-related businesses, with products used for packaging high-performance chips such as CPUs, GPUs, AI, and automotive applications, and the first phase of the project has been successfully put into production [1][2] Group 2 - Hefei Xinfeng Technology Co., Ltd., another invested company, focuses on the packaging and testing of storage chips, providing integrated packaging and testing services to clients [1][2]