通富微电：拟注册发行不超30亿元债务融资工具

Core Viewpoint - Tongfu Microelectronics announced plans to register and issue non-financial corporate debt financing instruments in the interbank bond market, with a total issuance scale not exceeding RMB 3 billion [1] Group 1: Issuance Details - The issuance will include short-term financing notes not exceeding RMB 1 billion and medium-term notes not exceeding RMB 2 billion [1] - The target investors for this issuance are institutional investors in the national interbank bond market [1] - The issuance interest rate will be determined based on market conditions and will be issued at par value [1] Group 2: Fund Utilization - The funds raised will primarily be used to supplement the company's working capital, repay loans from financial institutions, and for other purposes recognized by the China Interbank Market Dealers Association [1]