通富微电：拟注册发行银行间债券市场非金融企业债务融资工具

Core Viewpoint - The company plans to issue non-financial corporate debt financing instruments in the interbank bond market to optimize its debt structure and broaden financing channels, with a total amount not exceeding RMB 3 billion [1] Group 1: Company Actions - The company convened the 15th meeting of the 8th Board of Directors on November 28, 2025, to review the proposal for issuing debt financing tools [1] - The planned issuance includes short-term financing bonds and medium-term notes, with the specific registration scale subject to approval by the trading association [1]