TSMC(US:TSM) Guan Cha Zhe Wang·2025-12-02 05:29Core Insights - TSMC Chairman Wei Zhejia plans to visit mainland China for the first time in two and a half years, leading a delegation to the TSMC Open Innovation Platform (OIP) ecosystem forum in Nanjing [1][3] - The forum will focus on leveraging artificial intelligence to develop next-generation design solutions for TSMC's advanced processes and packaging technologies, addressing energy efficiency and other challenges for next-generation AI chips [3] - This visit may signal TSMC's exploration of collaboration opportunities with mainland companies, potentially leading to new factory plans [3] Group 1 - Wei Zhejia will be accompanied by two vice presidents during the visit to the OIP forum [1] - The OIP forum has been held in various locations including Silicon Valley, Tokyo, Hsinchu, and Amsterdam, with the final stop in Nanjing scheduled for December 4 [3] - The last visit to mainland China by Wei Zhejia was during the TSMC Technology Forum in Shanghai in 2023 [3] Group 2 - The forum will cover design processes and methodologies related to TSMC's A16, N2, and N3 processes [3] - The focus on AI's potential indicates TSMC's commitment to innovation in chip design and manufacturing [3] - The visit could enhance TSMC's relationships with local chip design companies in mainland China [3]