2025年中国低介电电子布行业发展现状、竞争格局及趋势预测

Core Insights - The low dielectric electronic fabric is a high-performance textile material with a dielectric constant (εr) lower than traditional electronic fabrics, primarily used in the electronics information field for applications like printed circuit boards (PCBs) and integrated circuit packaging, which helps reduce signal transmission delays and crosstalk, meeting the demands for high integration and high transmission rates in electronic devices [1][6][12]. Industry Overview - The global low dielectric electronic fabric market is experiencing significant growth, with the market size projected to increase from 59 million USD in 2020 to 181 million USD by 2025, reflecting a compound annual growth rate (CAGR) of 24.9%. Further forecasts suggest the market will reach 528 million USD by 2031, with a CAGR of 18.7% from 2025 to 2031, indicating strong development potential and market demand in the coming years [1][16]. Market Dynamics - The PCB industry is witnessing unprecedented growth opportunities driven by the global AI wave, with China's PCB market expected to reach approximately 412.11 billion CNY in 2024, further propelling the low dielectric electronic fabric sector [12][16]. Competitive Landscape - The production of low dielectric electronic fabric is characterized by high technical barriers, resulting in a limited number of manufacturers. Key global players include Nitto Denko (55% market share), Asahi Kasei (31%), and Taiwan Glass Group (11%) as of 2024 [2][19]. Research Methodology - The research team employs a combination of desktop research, quantitative surveys, and qualitative analyses, utilizing various models such as SCP, SWOT, PEST, regression analysis, and SPACE matrix to comprehensively analyze the market environment, industry policies, competitive landscape, technological innovations, and other relevant factors affecting the low dielectric electronic fabric industry [2][29]. Industry Chain Analysis - The upstream of the low dielectric electronic fabric industry includes raw materials and equipment such as high-purity quartz sand, silane coupling agents, and high-end jet looms, while the downstream encompasses applications in copper-clad laminates, PCB manufacturing, and AI servers [9][10].