Core Viewpoint - The company, Sytak (301568.SZ), emphasizes the application of its core products, 3D SPI and 3D AOI, in the detection of chip packaging processes, specifically for assessing the quality of solder balls and solder paste [1] Group 1 - The 3D SPI (3D Solder Paste Inspection) and 3D AOI (3D Automated Optical Inspection) are key products that can be utilized in chip packaging quality detection [1] - The company plans to launch a new optical inspection device, referred to as the "third optical inspection machine," in 2024, which will focus on detecting processes such as flux, chip bonding, wire bonding, and flip chip connections [1] - This new device is positioned as a critical inspection tool within the chip packaging industry [1]
思泰克(301568.SZ)：核心产品3D SPI和3D AOI均能够应用于芯片封装工艺的检测