常熟银行:5亿元2025年科技创新债券发行完毕

Core Viewpoint - Changshu Bank has successfully issued a 5 billion RMB technology innovation bond, approved by the People's Bank of China, aimed at supporting technology innovation businesses [1] Group 1: Bond Issuance Details - The bond was recorded on December 4, 2025, and completed issuance on December 8, 2025 [1] - It is a 5-year fixed-rate bond with a coupon rate of 1.90% [1] Group 2: Purpose and Impact - The funds raised from this bond will be used to specifically support businesses in the technology innovation sector, subject to applicable laws and regulatory approvals [1] - The successful issuance of this bond expands the financing channels for supporting technology innovation enterprises and helps reduce their financing costs [1] - This initiative further aids the bank in enhancing its development in technology innovation business [1]