常熟银行成功发行5亿元科技创新债券

Core Viewpoint - Changshu Bank has successfully issued a 5 billion RMB technology innovation bond, approved by the People's Bank of China, aimed at supporting technology innovation businesses [1][3]. Group 1: Bond Issuance Details - The bond issuance was completed on December 4, 2025, with formal issuance on December 8, 2025 [3]. - The bond has a total scale of 5 billion RMB and a maturity period of 5 years, with a fixed interest rate of 1.90% [3]. Group 2: Purpose and Impact - The funds raised from this bond will be specifically used to support businesses in the technology innovation sector, in compliance with legal and regulatory requirements [3]. - The successful issuance of the technology innovation bond will broaden the financing channels for the bank to serve technology innovation enterprises and help reduce their financing costs [3]. - This initiative will enhance the bank's capability in the technology innovation sector, providing stronger financial support for the development of technology innovation enterprises [3].