【企业热点】PCB大企景旺电子宣布赴香港IPO

Group 1 - The company plans to apply for the listing of H-shares on the Hong Kong Stock Exchange, with each share having a par value of RMB 1.00 [2] - The issuance will involve a public offering in Hong Kong and an international placement of new shares, with the total number of H-shares not exceeding 10% of the company's total share capital post-issuance, prior to any exercise of the over-allotment option [2] - The raised funds will be used for expanding production capacity, upgrading existing facilities, enhancing research and development, repaying bank loans, supplementing working capital, and general corporate purposes after deducting relevant issuance costs [2]