Hygon Information Technology (SH:688041) Sou Hu Cai Jing·2025-12-12 07:15Core Insights - The unique advantage of China's computing power industry lies in its scenario-driven innovation model [2][3] - The industry is transitioning from "having computing power" to "sufficient and high-quality computing power" amid global competition [2] - Key challenges include process bottlenecks, software ecosystem maturity, and systematic engineering [5][7][11] Group 1: Key Bottlenecks - The primary bottleneck in China's computing power is the software stack, particularly the compiler toolchain, which requires time for domestic chip companies to catch up [5][7] - Process limitations affect both chip performance and interconnect bandwidth, necessitating breakthroughs in the upstream AI industry [7][11] - Identifying the right application scenarios is crucial for overcoming software stack issues and optimizing computing power [9][11] Group 2: Supernodes and Clusters - Transitioning from thousands to tens of thousands of cards in clusters presents significant non-linear challenges, particularly in communication bandwidth and latency [14][20] - Supernodes are recognized for their utility in both training and inference scenarios, aiming to reduce costs associated with token generation [14][20] - The choice between Scale-up and Scale-out architectures impacts performance and flexibility, with liquid cooling becoming essential for high-density nodes [20][21] Group 3: Edge-Cloud Collaboration - The commercialization of integrated storage and computing technology is approaching, with significant market demand expected once a "Killer APP" emerges [17][23] - Edge AI can enhance privacy by processing sensitive data locally, reducing the risk of data leaks [18][23] - Edge devices are projected to handle over 50% of computing tasks, necessitating a balance between local processing and cloud collaboration [17][18] Group 4: Interconnect and Liquid Cooling - The debate between Scale-up and Scale-out approaches highlights the importance of interconnect efficiency and bandwidth in supernodes [20][21] - Liquid cooling is identified as a necessary solution for high-density nodes, offering energy savings and noise reduction [21][22] Group 5: Engineering Practices - Real-world deployment often reveals discrepancies between theoretical specifications and actual performance, necessitating iterative product improvements [23] - Collaborative ecosystems, such as the chip model community, are essential for optimizing chip performance across various applications [23][24] - China's advantages in system engineering and application diversity provide a robust foundation for innovation in the computing power sector [24]