立中集团(300428.SZ)：研发的硅铝合金、铝碳化硅等新材料目前用于航空航天、光学等领域的集成电子封装和芯片封装

Core Viewpoint - The company has developed new materials such as silicon-aluminum alloy and aluminum carbide silicon, which are currently used in aerospace, optics, and integrated electronic packaging, as well as chip packaging. These materials are also applicable for the casing packaging of optical modules in CPO [1] Group 1 - The new materials are utilized in aerospace and optical fields [1] - The materials are suitable for integrated electronic packaging and chip packaging [1] - The company’s products can be applied in the casing packaging of optical modules in CPO [1]