方邦股份(688020.SH)：公司带载体可剥离超薄铜箔主要应用于IC载板和类载板的制备

Core Viewpoint - Fangbang Co., Ltd. (688020.SH) is experiencing growth in demand for its peelable ultra-thin copper foil, primarily used in the production of IC substrates and similar substrates, with expectations for increased order volume in the next 1-2 years [1] Group 1 - The company's peelable copper products have passed batch verification from representative substrate and leading chip terminal customers [1] - Continuous communication with customers has led to improvements in product quality and yield [1] - The company has successfully navigated the challenging initial phase of development, moving from "0 to 1" [1] Group 2 - The demand for peelable copper is anticipated to grow rapidly due to trends such as the rapid development of AI technology, advanced packaging routes like CoWoP, and the adoption of SLP-type substrates in 800G/1.6T optical modules [1]