方邦股份(688020.SH)：自产的PI/TPI材料主要用于FCCL产品

Core Viewpoint - The company has developed resin materials that are coated on ultra-thin copper foil to create RCC or FRCC materials for ultra-fine circuit production, currently in the customer testing phase [1] Group 1 - The company is utilizing its proprietary formulation technology to produce PI/TPI materials primarily for FCCL products, which are not yet being sold externally [1]