TKGF(SH:601233) Sou Hu Cai Jing·2025-12-23 14:28Core Viewpoint - Tongkun Co., Ltd. has successfully redeemed its fifth phase of technology innovation bonds, indicating strong financial management and commitment to fulfilling debt obligations [1][2] Group 1: Stock Performance - As of December 23, 2025, Tongkun's stock closed at 15.84 CNY, reflecting a slight decrease of 0.06% from the previous trading day [1] - The stock opened at 15.84 CNY, reached a high of 16.04 CNY, and a low of 15.7 CNY during the trading session [1] - The total market capitalization of the company is 38.092 billion CNY, with a trading volume of 3.7 billion CNY and a turnover rate of 0.97% [1] Group 2: Bond Issuance and Redemption - The fifth phase of technology innovation bonds, issued on June 20, 2025, had a total issuance amount of 500 million CNY and a maturity period of 183 days [1] - The bonds carried an interest rate of 1.79% and were fully redeemed on December 23, 2025, with a total repayment amount of 504,487,260.27 CNY [1]