龙迅股份IPO:四次分红合计超2亿元,美国籍董事长陈峰控股44%

Core Viewpoint - Longxin Semiconductor Co., Ltd. has submitted an application for listing on the Hong Kong Stock Exchange, with CITIC Securities as the exclusive sponsor [2]. Group 1: Company Overview - Longxin Semiconductor was established in 2006 and is a leading designer of high-speed mixed-signal chips, focusing on building efficient and reliable "data highways" for smart terminals, devices, and AI applications [3]. - As of December 23, 2023, Longxin Semiconductor's total market capitalization is approximately 9.793 billion RMB [3]. Group 2: Market Position - According to Frost & Sullivan, Longxin Semiconductor ranks first in the mainland China video bridging chip market and is among the top five fabless design companies globally by revenue in 2024 [3]. Group 3: Financial Performance - The company's revenue for the years 2022, 2023, 2024, and the first nine months of 2025 are reported as 240.938 million RMB, 323.147 million RMB, 466.003 million RMB, and 389.203 million RMB respectively [4]. - The corresponding net profits for the same periods are 69.206 million RMB, 102.696 million RMB, 144.412 million RMB, and 124.508 million RMB [4]. Group 4: Dividend Distribution - Longxin Semiconductor has distributed dividends of 29.6 million RMB, 20.8 million RMB, 96.5 million RMB, and 71 million RMB for the years 2022, 2023, 2024, and the first nine months of 2025, totaling 217.9 million RMB [5]. Group 5: Shareholding Structure - Prior to the IPO, Feng Chen directly held 37.53% of the shares and controlled an additional 3.31% through Chip Wealth, along with 3.45% voting rights through an irrevocable proxy from his mother, totaling approximately 44.29% control [7].