华海诚科：高密度集成电路和系统级模块封装用环氧塑封料项目结项

Core Viewpoint - Huahai Chengke (688535.SH) announced the completion of its epoxy resin project for high-density integrated circuits and system-level module packaging, with surplus funds to be used for working capital [1] Group 1: Project Completion - The epoxy resin project has reached the predetermined usable state and is set for completion [1] - A total of 82.21 million yuan has been invested in the project, which is 44.67% of the planned total investment of 184.02 million yuan [1] Group 2: Financial Implications - Surplus funds amounting to 101.85 million yuan will be permanently allocated to supplement the company's daily operational working capital [1]