HHCK(SH:688535) Sou Hu Cai Jing·2026-01-07 07:56Core Viewpoint - The acquisition of 70% stake in Hengsuo Huawai by Huahai Chengke marks a significant step in enhancing the domestic semiconductor packaging materials industry, aiming to improve international competitiveness and technological capabilities in the sector [1][5]. Company Overview - Huahai Chengke, established in December 2010, is a national-level specialized and innovative "little giant" enterprise focused on the R&D and industrialization of semiconductor chip packaging materials, with a complete R&D and production system and independent intellectual property rights [1]. - Hengsuo Huawai is recognized as a national-level specialized and innovative "little giant" enterprise, with a strong global sales network and a product range that includes over a hundred models under the Hysol brand [2]. Financial Performance - As of December 31, 2024, Huahai Chengke reported total assets of 53.53 billion, total liabilities of 13.21 billion, and total equity of 40.33 billion, indicating growth from the previous year [4]. - The company's revenue for 2024 was 46.78 billion, with a net profit of 4.57 billion, reflecting an increase from 2023 [4]. Market Context - The semiconductor packaging materials market is projected to grow significantly, with epoxy molding compounds being critical for the semiconductor industry, as over 90% of semiconductor chips utilize these materials [4][5]. - The domestic demand for semiconductor supply chain security is urgent, given the low localization rate of high-performance packaging materials in China, which is only 10%-20% [4]. Acquisition Details - The acquisition of Hengsuo Huawai was valued at 1.12 billion, with payment structured through cash, shares, and convertible bonds, allowing for a balanced approach to meet various shareholder needs [6][7]. - The cash payment of 320 million was aimed at addressing short-term liquidity needs of certain shareholders, while share issuance and convertible bonds were designed to bind long-term value supporters [7][9][10]. Strategic Implications - The acquisition is expected to extend Huahai Chengke's production and sales base to international markets such as South Korea and Malaysia, enhancing its global market share and competitiveness [5]. - The multi-faceted payment structure of cash, shares, and convertible bonds is seen as a strategic move to mitigate risks associated with valuation discrepancies and to ensure a smooth integration post-acquisition [10][12]. Industry Outlook - The global semiconductor materials market is anticipated to grow by 3.8% in 2024, reaching approximately 67.5 billion, with packaging materials revenue expected to increase by 4.7% to 24.6 billion [5]. - The Chinese packaging materials market is projected to reach 7.86 billion by 2025, growing at a rate of 7.23% [5].