世运电路：围绕玻璃基板相关工艺与产业链关键环节进行技术研究和上下游交流

Core Viewpoint - The company is actively engaged in research and development of TGV glass substrates, which represent a cutting-edge technology in the semiconductor packaging field [1] Group 1: Company Initiatives - The company has initiated forward-looking research and layout regarding TGV glass substrates in recent years [1] - The company is conducting technical research and communication across key processes and the industrial chain related to glass substrates [1] - The company is tracking and reserving high-quality targets in the domestic glass substrate sector [1]