世运电路(603920.SH)：围绕玻璃基板相关工艺与产业链关键环节进行技术研究和上下游交流

Core Viewpoint - The company is actively engaged in the research and development of TGV glass substrates, which represent a cutting-edge technology in the semiconductor packaging field [1] Group 1: Company Initiatives - The company has initiated forward-looking research and layout regarding TGV glass substrates in recent years [1] - The company is conducting technical research and engaging in upstream and downstream communication related to glass substrate processes and key links in the industry chain [1] - The company is tracking and reserving high-quality targets in the domestic glass substrate sector [1]