立昂微：部分募集资金投资项目延期

Core Viewpoint - The company has announced a delay in the completion date of its "annual production of 1.8 million 12-inch semiconductor silicon epitaxial wafers project" to December 2027 due to ongoing challenges in the semiconductor silicon wafer industry [1] Group 1: Project Details - The project is planned to utilize a total investment of 1.13 billion yuan, sourced from publicly issued convertible bonds [1] - The delay is attributed to insufficient capacity utilization of already operational production lines and significant profitability pressures [1] - The new epitaxial workshop has been topped out, with cleanroom construction expected to be completed by August 2026, followed by a lengthy equipment installation and debugging period [1] Group 2: Strategic Decisions - The delay is described as a prudent decision based on changes in market conditions, with no impact on the project's implementation entity, investment purpose, or scale [1] - The company asserts that this decision will not materially affect its main business or overall fundraising arrangements, nor will it harm shareholder interests [1] - The company plans to dynamically adjust the construction pace to enhance the efficiency of fund utilization [1]