Core Viewpoint - Tongfu Microelectronics (002156.SZ) plans to issue A-shares to specific investors in 2026, aiming to raise up to 4.4 billion yuan for various capacity enhancement projects and working capital [1] Group 1: Stock Issuance Details - The company intends to issue shares to no more than 35 specific investors [1] - The issuance price will be no less than 80% of the average trading price of the company's stock over the 20 trading days prior to the pricing benchmark [1] - The total number of shares issued will not exceed 30% of the company's total share capital before the issuance, amounting to a maximum of 455 million shares [1] Group 2: Fund Utilization - The total funds raised will not exceed 4.4 billion yuan, including issuance costs [1] - The funds will be allocated to enhance storage chip testing capacity, testing capacity for emerging applications in the automotive sector, wafer-level testing capacity, high-performance computing and communication testing capacity, as well as to supplement working capital and repay bank loans [1]
通富微电拟定增募资不超44亿元 主要用于多项封测产能提升项目