通富微电拟定增募资不超44亿元，用于存储芯片封测产能提升项目等

Core Viewpoint - Tongfu Microelectronics (002156) plans to issue shares to specific investors, aiming to raise a total of no more than 4.4 billion yuan (including the principal) [1] Group 1: Fundraising Purpose - The funds raised will be used for enhancing packaging and testing capacity for storage chips [1] - The capital will also support packaging and testing capacity improvements in emerging applications such as automotive [1] - Additional allocations include enhancing wafer-level packaging capacity and supporting high-performance computing and communication sectors [1] - A portion of the funds will be used to supplement working capital and repay bank loans [1]