澜起科技港股IPO招股书失效

Group 1 - The company, 澜起科技股份有限公司 (Lanqi Technology), submitted its Hong Kong IPO prospectus on July 11, 2025, which will expire on January 12, 2026, with CICC, Morgan Stanley, and UBS as joint sponsors [1] - The company is a global leader in the fabless integrated circuit design sector, focusing on innovative, reliable, and high-performance interconnect solutions for cloud computing and AI infrastructure [2] - It provides interconnect chips, including memory interconnect chips and PCIe/CXL interconnect chips, with applications across a wide range of end-user fields such as data centers, servers, and computers [2] Group 2 - According to Frost & Sullivan, the company is projected to be the largest supplier of memory interconnect chips globally in 2024, with a market share of 36.8% based on revenue [2]