帝尔激光(300776.SZ)：目前公司已经完成面板级玻璃基板通孔设备的出货

Core Viewpoint - The company has developed TGV laser micro-hole equipment that enables precise processing of glass substrates, facilitating subsequent metallization processes for applications in semiconductor and display chip packaging [1] Group 1: Technology and Applications - The TGV laser micro-hole equipment utilizes a precision control system and laser modification technology to process various materials [1] - The equipment is applicable in fields such as semiconductor chip packaging and display chip packaging [1] - The company has completed the shipment of panel-level glass substrate through-hole equipment, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology [1]