兴森科技(002436.SZ)：具备CoWoP封装相关的技术和产品，主要应用领域包括高速服务器架构等

Core Viewpoint - The company, Xingsen Technology, emphasizes its capabilities in CoWoP packaging technology and products, targeting high-speed server architecture as a primary application area [1] Group 1 - The company possesses technology and products related to CoWoP packaging [1] - The main application areas for the company's technology include high-speed server architecture [1] - The company places a high priority on the research and development of new products, technologies, and processes [1]