Group 1 - The company, Lianqi Technology (06809), plans to conduct a global offering of 65.89 million shares from January 30 to February 4, 2026, with a maximum offer price of HKD 106.89 per share [1] - The company is a leading fabless integrated circuit design firm focused on providing innovative, reliable, and energy-efficient interconnect solutions for cloud computing and AI infrastructure [1] - According to Frost & Sullivan, the company is projected to be the largest supplier of memory interconnect chips globally in 2024, holding a market share of 36.8% by revenue [1] Group 2 - The company offers a full range of memory interface chips from DDR2 to DDR5, including supporting chips like SPD, TS, and PMIC, which are critical for stable data transmission between CPUs and DRAM modules in servers [2] - The company has two main product lines: interconnect chips and Zindai products, with interconnect chips including memory interface chips, PCIe/CXL interconnect chips, and clock chips [2] Group 3 - The company has secured cornerstone investments totaling USD 450 million from various investors, including JPMIMI and UBS AM, under specific conditions [3] - The estimated net proceeds from the global offering are approximately HKD 6.905 billion, assuming no exercise of the over-allotment option and a share price of HKD 106.89 [3] - About 70% of the proceeds will be allocated to R&D in the interconnect chip sector over the next five years, while 5% will enhance commercialization capabilities, 15% for strategic investments or acquisitions, and 10% for working capital and general corporate purposes [3]
澜起科技1月30日至2月4日招股 预计2月9日上市