晶合集成：拟将部分募投项目结项，13304.90万元节余资金拟用于永久补充流动资金

Core Viewpoint - The company has announced the conclusion of certain fundraising projects and plans to permanently supplement its working capital with the remaining funds, which amounts to 133.05 million yuan [1] Group 1: Project Conclusion - The company held its 30th meeting of the 2nd Board of Directors on February 6, 2026, where it approved the proposal to conclude certain fundraising projects [1] - The concluded projects include the "Back-illuminated CMOS Image Sensor Chip Process Platform R&D Project" (including 90nm and 55nm) and the "28nm Logic and OLED Chip Process Platform R&D Project," both of which have reached the predetermined usable status [1] Group 2: Fund Allocation - As of January 31, 2026, the remaining fundraising amount is 133.05 million yuan, which includes interest income after deducting handling fees, investment income, unpaid amounts, and expenses paid with self-owned funds that have not been replaced [1] - The company plans to use the entire remaining fundraising amount to permanently supplement its working capital for daily production and operations [1] - After the transfer of the remaining funds, the company will cancel the corresponding fundraising special accounts at various banks [1]